Reflow Soldering

Reflow soldering systems from SEHO stand for innovative technology and they are designed to increase profitability of your production: With ideal heat energy transfer and minimum maintenance

SEHO GoReflow

Small Machine – Great Performance

With a heating zone length of 1850 mm [72.8″] or 2350 mm [92.5″] the convection reflow soldering systems GoReflow 1.8 and GoReflow 2.3 are ideally suited for small to medium-sized production series.
The machines are not only featured with an outstanding attractive design, above all the GoReflow systems convince with their well-engineered concept and excellent soldering results.
The GoReflow systems are characterized by flexible application for single-sided or double-sided reflow processes, in high-temperature processes and for curing adhesives and underfills.

Your Advantages at a Glance:
- compact machine technology for small and medium-sized production series
- high number of heating zones, exclusively with full convection, to guarantee perfect soldering results
- efficient and homogeneous energy transfer with optimized process gas circulation
- flux management system ensures minimum maintenance requirements
- low costs of ownership
- high process reliability
- inline integration with matching interfaces
- unbeatable price-performance ratio

Download Brochure

SEHO PowerReflow-2

The Powerful System for Your SMT Production

SEHO PowerReflow-2 was developed for medium to large production series. The system excels by its highly efficient energy transfer and its modern design. With comparatively low investment costs and low operating expenses, SEHO PowerReflow-2 offers ideal value for money, thus ensuring high profitability in your surface mount production.
The systems can be operated for soldering in a normal or nitrogen atmosphere, depending on the materials that are to be processed and the process window that is available for the given products.

Your Advantages at a Glance:
- perfect soldering results for mid-size production volumes
- powerful heat transfer due to optimized process gas leading principle
- high flexibility in temperature profiling and high thermal stability
- low set temperatures ensure component-sensitive processes
- filterless process gas cleaning system guarantees low maintenance requirements
- low operation costs
- simple to operate

Download Brochure

SEHO MaxiReflow

Excellent Reflow Soldering

SEHO MaxiReflow, which won a Global Technology Award, sets a milstone in soldering technology. The system is equipped with a revolutionary, thermally invisible conveyor system, an effective and component-sensitive heat transfer technology as well as a highly efficient residue management with process gas cleaning. Maximum process reliability, maximum soldering quality and maximum machine availability arrive at one conclusion: SEHO MaxiReflow.

Your Advantages at a Glance:
- winner of the Global Technology Award
- ‘Voidless Pressure Chamber’ ensures virtually void-free solder joints
- worldwide unique: thermally invisible conveyor system
- maximum process reliability with 100 % parallel alignment of the conveyor rails
- efficient residue management ensures long maintenance intervals
- optimum, powerful heat transfer at component-sensitive set temperatures
- flexible temperature management due to a high number of heating zones
- effective, multi-stage cooling zone
- high machine availability
- automatic recording of machine and process data with comfortable software tools
- low operation costs
- various machine lengths – to perfectly suit your specific manufacturing requirements

Download Brochure